Paul Compston, CEO and director; Silvano Sommacal, technical lead, Advanced Diagnostics Division; and John Holmes, senior engineer, New Frontier Technologies Shown here is the laser tape placement ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

Genie Sim 3.0 draws from more than 10,000 hours of synthetic dataset, including real-world robot operation scenarios.

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

Two Harvard researchers developed a 3D simulation that may help explain the hexagonal pattern of a large storm observed on Saturn. Researcher Rakesh K. Yadav and Geophysics professor Jeremy Bloxham ...