Next-generation semiconductor products increasingly rely on vertical integration technologies to drive system density, speed, and yield improvement. Due to the increased coupling effects across ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit Designers can achieve system-driven PPA through the availability of integrated thermal, ...

Machines are moving beyond single-point sensing. Multi-sensor fusion now delivers vision, ranging and inertial data. The ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...

Yiqi is a thought leader in Digital Journal’s Insight Forum (become a member). In the rapidly evolving landscape of design, the integration of 3D technology is no longer a niche reserved for animation ...

From 3D-printed prototypes to immersive game worlds, the demand for 3D content is surging across industries—and with it, the ...

InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, ...