Samsung vice president Kim Dae-woo said the South Korean giant made its new 16-layer HBM with HBM3 but plans to use HBM4 to improve productivity. Due to alignment issues, Samsung was expected to use ...
Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die ...
As advanced packaging pushes deeper into the sub-10µm realm, traditional inspection and metrology systems are being forced to evolve with it. Hybrid bonding, a critical enabler of vertical integration ...
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