Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
At one time, chip packaging was an afterthought. Chipmakers were more worried about IC design. Packaging was considered a mere commodity, which was simply used to house the design. More recently, ...
Leading integrated circuit (IC) foundries are already shipping 7-nm and 5-nm wafers and 3-nm product qualifications are ongoing. Wafer costs continue to soar as high transistor density requires ever ...
DUBLIN, March 8, 2019 /PRNewswire/ -- The "Advanced IC Packaging Technologies, Materials, and Markets 2018 Edition" report has been added to ResearchAndMarkets.com's offering. The demand for consumer ...
The need to move large quantities of data at high speeds continues to increase, pressuring component manufacturers to improve their technology and, simultaneously, to reduce costs. One of the key ...
MILPITAS, Calif., Aug. 30, 2018 /PRNewswire/ -- Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products designed to address a wide variety of integrated circuit (IC) ...
Ottawa, Nov. 26, 2025 (GLOBE NEWSWIRE) -- The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and this figure is projected to grow to USD 114.28 ...
Advanced packaging that’s no bigger than the die itself brings together high performance and high reliability with small size and low cost. Not so long ago, defense and aerospace applications were the ...
CHICAGO, March 25, 2024 /PRNewswire/ -- The report "Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die ...
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