Many industry trends are driving chip developers to consider multi-die designs using advanced 2.5D and 3D technologies. Such designs enable incorporating heterogeneous and homogeneous dies in a single ...

LEO pioneer Peter Hermon, who oversaw the technology integration of airlines BEA and BOAC to form BA in the 1970s, has died, aged 93. Hermon’s career in IT began when he joined J Lyons & Co in 1954.

The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless ...

A new systems design toolset aims to create a unified user experience for board designers while adding cloud connectivity and artificial intelligence (AI) capabilities, which will enable engineers to ...

Enterprise software strategies tend to go in cycles, particularly for implementing business applications, but whatever approach is dominant, fundamental challenges such as system integration can ...