Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...

Semiconductor companies have come to rely on delay testing to attain high defect coverage of manufactured digital ICs. Delay testing uses TD (transition-delay) patterns that ATPG ...

At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...

A monthly overview of things you need to know as an architect or aspiring architect. Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with ...

A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging” was published by researchers at Arizona State University. “Fan-out ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with content, and download exclusive resources. Vivek Yadav, an engineering manager from ...