Ainos Announces Distribution Partnership with Trusval Technology to Expand AI Nose into Semiconductor Front-End Manufacturing

Partnership Supports Ainos' 2026 Strategic Focus on Advancing AI Nose Upstream and Accelerating Scent Data Accumulation in Advanced Wafer Fabs HOUSTON, TX / ACCESS Newswire / January 7, 2026 / Ainos, ...
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China's SiCarrier challenges U.S. and EU with full-spectrum of chipmaking equipment — Huawei-linked firm makes an impressive debut

Chinese chipmakers have been gradually shifting some of their production to tools made in China in a bid to support the local wafer fab equipment ecosystem and reduce reliance on tools produced abroad ...

Viettel begins construction of Vietnam's first chip plant, trial run targeted by end‑2027

Vietnam's military-run telecom company Viettel on Friday began construction of the country's first semiconductor fabrication plant, with trial production expected to start by late 2027, part of ...
Plant Services

The Industrial Science Report: Manufacturing technologies and skills powering semiconductor fabs

This edition explores how materials science, nanofabrication, and workforce development intersect to support a resilient U.S.
Semiconductor Engineering

Secure Data Sharing Becoming Critical For Chip Manufacturing

Driven by a plethora of benefits, data sharing is gradually becoming a “must have” for advanced device nodes and multi-die ...
Digi Times

The Packaging Pivot Driving AI Chip Performance

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.
EurekAlert!

GaN-based electron beam technology from Nagoya University startup poised to overcome critical semiconductor manufacturing challenges at KIOXIA

New platform for semiconductor inspection and metrology developed through joint research by Photo electron Soul and Nagoya University begins validation at KIOXIA Iwate NAGOYA, Japan — In late ...
EDN

Asyst Secures Multiple Orders For 300mm FOUPs

Asyst Technologies Inc. today said it has received multiple orders for its 300mm front-opening unified pods (FOUPs) from semiconductor foundries in Taiwan and Europe. Fremont, Calif.-based Asyst ...
Digi Times

Kenmec partners with Germany's Neura Robotics to automate semiconductor back-end processes

Kenmec Mechanical Engineering has entered into an exclusive agency agreement with German humanoid robot startup Neura Robotics to enhance intelligent in-factory logistics, with an initial focus on ...
JD Supra

BIS Implements Additional Due Diligence Measures for Front-End Fabricators and Outsourced Semiconductor Assembly and Test Companies

This January 16 interim final rule by the US Department of Commerce’s Bureau of Industry and Security (BIS) imposes a broader license requirement on two types of parties: “front-end fabricators” and ...

Ainos, Inc.: Ainos Announces Distribution Partnership with Trusval Technology to Expand AI Nose into Semiconductor Front-End Manufacturing

Partnership Supports Ainos' 2026 Strategic Focus on Advancing AI Nose Upstream and Accelerating Scent Data Accumulation in Advanced Wafer Fabs HOUSTON, TX / ACCESS Newswire / January 7, 2026 / Ainos, ...