A Breakthrough Technology that Opens the Door to Next-generation, High-speed Communication and Measurement Applications TOKYO--(BUSINESS WIRE)--NTT Corporation (President and CEO: Akira Shimada, "NTT" ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Nisshinbo Micro Devices Inc. has deployed multiple Cadence ® solutions, including the AI-based ...

Trigence Semiconductor has launched the first audio IC module (ICM) based on TDK’s semiconductor embedded substrate (SESUB) packaging technology. It’s an all-in-one audio output solution for ...

Ismail Hakki TOPCU (IHT) – Managing Partner and Engineering Director: First of all, let me briefly explain what a System-on-Module (SoM) is; A System-on-Module (SoM) is a ready-made electronic board ...

Shrinking the "Blue Module," a host-controller-interface-level Bluetooth radio module, to 9.8 by 9.6 by 1.8 mm didn't spare integration and performance. In fact, both rose to even higher levels.

Mouser Electronics, Inc. is now stocking a new RFID module from Murata that is a small-sized HF band IC with embedded antenna. LXMS33HCNG-134 is the newest addition to the MAGICSTRAP series of RFID ...

VANCOUVER, British Columbia — Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce a major milestone for its satellite communication module, CC200A-LB, which has ...

1. The BM83 from Microchip Technology is a complete Bluetooth RF module that incorporates the company’s IS2083BM high-functionality audio IC. With its diminutive 5.5- × 5.5-mm BGA package, the ...

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

To achieve this breakthrough, NTT applied its InP-based heterojunction bipolar transistor (InP HBT) technology1to improve the performance of amplifier ICs and package mounting technology to ...