You just built a breadboard of your expert design. You did all the simulations needed before going to layout, and reviewed the manufacturer's suggested techniques for a good thermal design for the ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

6. SOT-23 and SOIC packages are typically used in low-power motor drivers. Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6). To maximize the ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...