Copper interconnect was introduced to the mainstream at 130nm because of its significant advantages compared to aluminum, such as reduction in resistivity and power consumption and resistance to ...
The problem of variations induced by the chemical-mechanical polishing (CMP) step has been discussed for years in process engineering circles. Briefly, after each layer on the wafer is completed, the ...
People learning about semiconductor manufacturing might well be confused by the concept of metal fill. It seems perfectly intuitive that laying out a complex chip will result in some regions with ...
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