Frenchtown, N.J. – Aries Electronics has broadened its line of pin-grid-array zero-insertion-force (ZIF) Test Sockets with a 9 x 9-grid version. The units enable just one socket to handle a full range ...

The first image of AMD's upcoming Socket AM4, the new single platform for its Bristol Ridge and Zen CPU and APU products, has been leaked, revealing a pin-grid array (PGA) design with 1,331 pin ...

PARIS — Molex announced that three of its socket products have met the stringent criteria for Intel validation across all three computer market segments of server, desktop and notebooks. As an ...

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.