Customers are pushing for increasing power per board and implementing ever more silicon on the PCB with the result that increasing processing density in high-end server designs will continue to have ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

The power module packaging materials market will reach almost $6.1 billion by 2030 with a CAGR of almost 11% between 2024 and 2030, says Yole Group. The power module packaging materials market will ...

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...

Most luxury vehicles today run several millions of lines of code networking up to 100 electronic control units (ECUs) [1]. The higher the degree of electrification, comfort features, and advanced ...