Packaging innovation has always been critical to the cooling of components, especially for power-switching devices such as MOSFETs and IGBTs. The non-stop demand to make these devices smaller and ...

RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.

NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

The RF front-end market is undergoing a massive transformation, announces Yole Group in its new report, RF Front-End Module for Mobile 2025. The RF front-end module market for mobile devices is at a ...

If you’ve done any wireless work with hobby electronics you probably recognize this part. The green PCB is an RFM12B wireless board. They come in a few different operating bandwidths, the 433 MHz is ...

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...

With the exception of the iPhone, Apple's products largely lack technology to provide ubiquitous access to the outside world while on the go. However, a new proposal from the company would attempt to ...

Anton is the former Editor-in-Chief of Pocketnow.com. As publication leader, he brought Pocketnow as close as possible to the audience throughout the years, while leading a team of enthusiastic ...