NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

New top-side cooling packaging technology for RF power enables smaller, thinner and lighter radio units, supporting faster and easier deployment of 5G base stations Simplifies design and manufacturing ...

NXP Semiconductors has announced a family of top-side cooled radio frequency (RF) amplifier modules, based on a packaging design intended to enable thinner and lighter radios for 5G infrastructure.

EINDHOVEN, The Netherlands, June 06, 2023 (GLOBE NEWSWIRE) -- NXP Semiconductors (NASDAQ: NXPI) announced today a family of top-side cooled RF amplifier modules, based on a packaging innovation ...