Return to original Test Digest book review. VLSI Test Principles and Architectures: Design for Testability, Laung-Terng Wang, Chen-Wen Wu, and Xiaoquing Wen (editors), Elsevier Science ...
A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...
In the fast-paced world of semiconductor manufacturing, achieving higher yields and reducing costs are constant challenges. Ideally, yield should only be impacted by unavoidable defects when ...
During standardized chip fabrication, integrate circuit (IC) testing is conducted repeatedly to inspect the chips once they are manufactured. IC testing begins with wafer penetration before etched ...
EAST AURORA, N.Y.--(BUSINESS WIRE)--Astronics Corporation (NASDAQ: ATRO), a leading provider of advanced technologies for the global aerospace, defense, and semiconductor industries, announced today ...
Collaboration expands advanced package testing capabilities in the U.S. BEAVERTON, Ore., Nov. 8, 2022 /PRNewswire/ -- Tektronix Inc., a leading provider in test and measurement solutions, announced ...
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has begun taking orders for its new T2000 AiR system, a compact, air-cooled system optimized for low-cost testing in R&D ...
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