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New semiconductor etching process achieves five-fold speed improvement
After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...
Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...
Plasma chemistry and etching processes form the backbone of modern semiconductor fabrication, enabling the precise patterning and removal of material layers essential to device performance. By ...
Building circuits on a silicon chip is a bit like a game of Tetris — you have to lay down layer after layer of different materials while lining up holes in the existing layers with blocks of the ...
We first developed a virtual device structure to test how ALD thickness affects hole size uniformity and CD. We started our virtual experiment by using two crisscross SAQP processes and transferring a ...
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